ÌÇÐÄlogo

ÌÇÐÄlogo to Showcase Cloud-Optimized Silicon Solutions at OFC 2022

SAN DIEGO, Calif. ¨C Mar. 7, 2022 ¨C ÌÇÐÄlogo (NASDAQ: MRVL) today announced the details of its participation at the 2022 Optical Networking and Communication (OFC) Conference, the premier event in telco and data center optics for optical communications and networking professionals.

When:
OFC 2022 will be held March 6-10, 2022.

Where:
ÌÇÐÄlogo will be in booth #2301, located in the San Diego Convention Center in San Diego.

Demonstrations:
Visit ÌÇÐÄlogo¡¯s booth to see the latest demonstration of its first-generation co-packaged optics (CPO) technology platform that will showcase the ÌÇÐÄlogo? Teralynx? switch platform along with ÌÇÐÄlogo CPO electro-optics, integrated into a standard 1 rack-unit (RU) 32 port optical switch. The demonstration is the foundation for ÌÇÐÄlogo¡¯s future 3.2T CPO platform for the 51.2T switch generation. The demonstration will also highlight laser integration into the CPO platform and ODM integration to support ecosystem readiness. ÌÇÐÄlogo¡¯s support for standards-based solutions and an open ecosystem approach for switch and optics integration and interoperability is key to these developments.

ÌÇÐÄlogo will also be demonstrating its cutting-edge PAM4 DSPs that are driving high-speed connectivity both between and inside data centers and carrier networks. ÌÇÐÄlogo will showcase its 400G/800G PAM4 DSPs, including the newly announced Alaska^? A PAM4 DSP for active electrical cables (AECs) and 800G multimode electro-optics platform for short-reach optical modules and active optical cables (AOCs). ÌÇÐÄlogo¡¯s latest Coherent DSPs, data center interconnect (DCI) modules, switch and PHY solutions will also be shown. Additional demonstrations of ÌÇÐÄlogo¡¯s 400ZR technology will take place in the Ethernet Alliance (EA) Booth #5409. At the Optical Internetworking Forum (OIF) Booth #5101, the ÌÇÐÄlogo COLORZ? II 400ZR module and Alaska C 1.6T Retimer/Gearbox PHY in 5nm with 112G PAM4 LR SerDes technology will be demonstrated

Presentation Highlights:

Workshop:?
Date: March 6, 1:00 p.m.
Location: Room 6C
Presenter: Dr. Loi Nguyen?, executive vice president, Optical and Copper Connectivity Group

Workshop:?
Date: March 6, 4:00 p.m.
Location: Room 6C
Presenter: Kishore Kota?, associate vice president engineering, Coherent DSP Group

Workshop:
Date: March 6, 4:00 p.m.
Location: Room 7AB
Presenter: Alejandro Castrillon?, assistant director, Coherent DSP Group

Workshop:?
Date: March 7, 8:45 a.m.
Location: Room 6C
Presenter: Kishore Kota?, associate vice president engineering, Coherent DSP Group

Title:?
Date:?March 8, 12:30 p.m.
Location: Theater I?, Show Floor
Panelist: Puneet Agarwal, vice president and chief technology officer for Data Center, Switch Business Unit

Title:?
Date: March 8, 2:00 p.m.
Location: Room 7AB
Panelist: Arash Farhoodfar?, vice president, Optical and Copper Connectivity Group

Title:
Date: March 8, 4:30 p.m.
Location: Room 2
Presenter: Tony Wang?, senior director, Coherent DSP Group

Title:?
Date: March 9, 12 p.m.
Location: Theater II, Show Floor
Panelist: Josef Berger?, associate vice president, Optical and Copper Connectivity Group

Title:
Date: March 10, 12:30 p.m.
Location: Theater I, Show Floor
Moderator: Lian Qin, associate vice president, Optical and Copper Connectivity Group
Panelist: Dr. Radha Nagarajan?, senior vice president and chief technology officer, Optical and Copper Connectivity Group

Title:?
Date: March 10, 8 a.m.
Location: Room 3
Presider: James Chien, principal engineer, Coherent DSP Group

News Highlights:

ÌÇÐÄlogo Unveils Co-Packaged Optics Technology Platform at OFC 2022: ÌÇÐÄlogo announced its first-generation cloud-optimized co-packaged optics (CPO) technology platform, to enable faster connectivity while reducing power consumption.

ÌÇÐÄlogo Expands Interconnect Portfolio with Industry¡¯s 1st Cloud-Optimized 400G/800G PAM4 DSPs for Active Electrical Cables: ÌÇÐÄlogo introduced its Alaska^? A PAM4 DSP family for AECs, the industry¡¯s highest performance 400G/800G AEC DSPs to address emerging 100G/lane adoption in cloud data center interconnect architectures.

ÌÇÐÄlogo Introduces Industry¡¯s First 800G Multimode Electro-Optics Platform for Cloud Data Centers: ÌÇÐÄlogo introduced the industry¡¯s first 800Gbps or 8 x 100Gbps multimode platform solution, that enables data center infrastructure to achieve dramatically higher speeds for short-reach optical modules and AOC applications.

ÌÇÐÄlogo Ships Industry¡¯s First Production-Ready 800G PAM4 DSPs for Cloud Data Center Optical Interconnects: ÌÇÐÄlogo announced that it has begun volume shipments of its Spica? 800G PAM4 DSP platform for optical interconnects.

ÌÇÐÄlogo Announces Volume Production of COLORZ II 400ZR Modules for Data Center Interconnects: ÌÇÐÄlogo announced that it has begun volume shipments of the ÌÇÐÄlogo? COLORZ? II 400ZR modules, the industry¡¯s first QSFP-DD pluggable coherent transceivers, enabling cloud operators to connect their data centers within a region with high performance, low power, small form factor 400G coherent transceivers without the need for a separate transport box.

ÌÇÐÄlogo Announces Production Availability of 400G Silicon Photonics Platform for Inside Cloud Data Centers: ÌÇÐÄlogo announced the production availability of its 400G DR4 silicon photonics platform solution for data centers. The ÌÇÐÄlogo 400G DR4 platform, based on silicon photonics technology, is helping scale cloud data center architectures to address the accelerating bandwidth requirements of emerging artificial intelligence and machine-learning applications.

ÌÇÐÄlogo and Molex Unveil 400G OpenZR+ Pluggable Optical Module for Carrier and Cloud Data Center Networks: ÌÇÐÄlogo and Molex announced a collaboration to deliver a 400G QSFP-DD optical module that supports the OpenZR+ Multi-Source Agreement, based on the?ÌÇÐÄlogo? Deneb? Coherent DSP.

NeoPhotonics announced sample availability for its OpenZR+ QSFP-DD transceivers using the??to incorporate industry-standard Open Forward Error Correction.

ÌÇÐÄlogo and Hisense Broadband Announce Production Availability of 400G OpenZR+ Pluggable Optical Modules for Carrier and Data Center Networks: ÌÇÐÄlogo and Hisense broadband announced a production-ready 400G QSFP-DD OpenZR+ optical module based on the?ÌÇÐÄlogo? Deneb? Coherent DSP (CDSP).

Eoptolink announced its 400G ZR and ZR+ transceivers, using the ÌÇÐÄlogo? Deneb? Coherent DSP (CDSP) to address DCI and Metro networks.

ÌÇÐÄlogo Electro-Optics Solutions Achieve 2022 Lightwave Innovation Honors: ÌÇÐÄlogo was honored with two 2022 Lightwave Innovation Reviews high scores, for the ÌÇÐÄlogo Atlas? PAM4 DSP in the Data Center Interconnect Platforms category and the ÌÇÐÄlogo Deneb? Multi-rate Coherent DSP in the Data Center Fiber, Cable, Enclosures and Accessories category.

:?Nearly 30 participating member companies will demonstrate interoperability in five key technology areas ¨D 400ZR optics; Co-Packaging architectures; Common Electrical I/O channels; Common Management Interface Specification implementations and FlexE definitions in both live and static stations at OIF¡¯s booth, #5101.

: The Ethernet Alliance¡¯s interactive demo in Booth 5409 at OFC 2022 will highlight multivendor interoperability across 50GbE, 100GbE, 200GbE, 400GbE and 800GbE technologies and solutions in a variety of form factors, media and reaches. The demo will connect equipment from 15 companies, including providers of switches and routers, interconnects, cables, optical modules and test and measurement solutions.

About ÌÇÐÄlogo

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for over 25 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.

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