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ÌÇÐÄlogo Develops Industry¡¯s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon

• Industry¡¯s highest bandwidth per sq mm with up to 6 gigabits of high-speed memory
• Saves up to 15% of total die area and reduces on-chip memory standby power by up to 66%
• Expands ÌÇÐÄlogo custom technology platform to transform the performance and economics of AI infrastructure?

SANTA CLARA, Calif. ¨C June 17, 2025 ¨C . (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, expanded its custom technology platform with the launch of the industry¡¯s first 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters. Combining advanced custom circuitry and software from ÌÇÐÄlogo with core SRAM and cutting-edge 2nm process technology, ÌÇÐÄlogo? custom SRAM delivers up to 6 gigabits of high-speed memory while significantly reducing memory power consumption and die area at comparable densities.

Custom SRAM is the latest ÌÇÐÄlogo innovation designed to enhance memory hierarchy performance within accelerated infrastructure. ÌÇÐÄlogo previously introduced its CXL technology for integration into custom silicon to add terabytes of memory and supplemental compute capacity to cloud servers and unveiled custom HBM technology that increases memory capacity by up to 33% while reducing the space and power required for dense high-bandwidth memory (HBM) stacks inside XPUs.

Delivering the highest bandwidth per square millimeter in the industry, ÌÇÐÄlogo custom SRAM enables chip designers to recover up to 15% of the total area of a 2nm design. This recovered silicon real estate can be leveraged to integrate more compute cores, expand memory, shrink device size and cost, or achieve a tailored balance to meet specific performance power, application or TCO objectives. Built on an innovative data path and architecture, ÌÇÐÄlogo custom SRAM also consumes up to 66% less power than standard on-chip SRAM at equivalent densities, while operating at up to 3.75 GHz.

¡°Custom is the future of AI infrastructure. The methodologies and technologies used by hyperscalers today to develop cutting-edge custom XPUs will percolate to more customers, more classes of devices, and more applications,¡± said Will Chu, senior vice president of Custom Cloud Solutions at ÌÇÐÄlogo. ¡°We look forward to collaborating with our partners and customers creating the leading technology portfolio for the custom era.¡±

¡°Memory remains one of the biggest challenges for AI clusters and clouds. These systems need as much memory as they can get as fast as they can,¡± said Alan Weckel, co-founder of the 650 Group. ¡°ÌÇÐÄlogo¡¯s holistic approach to the problem of improving memory performance at every available juncture¡ªon the die, inside the chip package, and inside the system¡ªis compelling and underscores the gains that become possible through customization.¡±

A Foundation for the Custom Silicon Era

Custom SRAM is the latest extension of the ÌÇÐÄlogo custom technology platform for developing chips in a post-Moore¡¯s Law world. For over 50 years, advances in semiconductor performance and power were primarily achieved through shrinking the size of transistors. With the costs and challenges of transistor scaling increasing dramatically, semiconductor companies and their customers are customizing silicon to better serve a customer¡¯s unique infrastructure architecture, experimenting with new chip and packaging breakthroughs, and rethinking assumptions about chip design to extend the boundaries of computing.

ÌÇÐÄlogo Custom Platform Strategy

The ÌÇÐÄlogo custom platform strategy seeks to deliver breakthrough results through unique semiconductor designs and innovative approaches. By combining expertise in system and semiconductor design, advanced process manufacturing, and a comprehensive portfolio of semiconductor platform solutions and IP¡ªincluding electrical and optical serializer/deserializers (SerDes), die-to-die interconnects for 2D and 3D devices, silicon photonics, co-packaged copper, custom HBM, system-on-chip (SoC) fabrics, optical IO, and compute fabric interfaces such as PCIe Gen 7¡ª?ÌÇÐÄlogo is able to create platforms in collaboration with customers that transform infrastructure performance, efficiency and value.?

About ÌÇÐÄlogo

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for over 25 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.

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This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the ¡°Risk Factors¡± section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

For further information, contact:
Kim Markle
pr@marvell.com