ÌÇÐÄlogo

ÌÇÐÄlogo at the OCP Global Summit

Join ÌÇÐÄlogo at the 2023 OCP Global Summit in San Jose, California, the premier event uniting the most forward-thinking minds in open IT ecosystem development.

With the explosive growth of AI, cloud operators must scale their networks up and out to meet the overwhelming ¡°need for speed¡± these networks demand. Future data center architectures will clear the bandwidth, latency, storage and memory bottlenecks that keep today¡¯s networks from making full use of their compute capacity.

Stop by the ÌÇÐÄlogo booth (B13) to learn more about how the ÌÇÐÄlogo data center portfolio is advancing the next generation of cloud and AI networks. We¡¯ll demonstrate the latest developments in in AI and cloud data infrastructure silicon, including:

• Nova? PAM4 DSP for AI and cloud connectivity
• COLORZ^? 800 ZR/ZR+ modules for data center interconnect
• Teralynx^??Ethernet switches for cloud and AI networking?
• Bravera? PCIe Gen5 SSD controller

ÌÇÐÄlogo technology will also be demonstrated in partner booths, including:

Arm, booth B14: First Open Programmable Infrastructure project use case demonstration including Arm? Neoverse?-based ÌÇÐÄlogo? OCTEON? 10. (See press release: ÌÇÐÄlogo, F5 and Arm Collaborate to Enable First Open Programmable Infrastructure Project Demonstration at 2023 OCP Global Summit)

Microsoft, booth B7: ÌÇÐÄlogo PAM4 DSP technology driving 200 Gbps per lane over electrical channels optimized for a Microsoft-specific copper-channel use case. (See press release: ÌÇÐÄlogo Demonstrates 200G Electrical Interconnect Technology at 2023 OCP Global Summit)

OCP Experience Center

• TE will demonstrate a CDFP 4m+ passive copper cable running at 64GT/s (PCIe Gen 6) driven by ÌÇÐÄlogo's PCIe Gen 6 SerDes. For related information, read the whitepaper titled .
• Second generation long-reach Ethernet-capable SerDes chiplet from ÌÇÐÄlogo.

Wistron NeWeb Corporation, booth B24: ÌÇÐÄlogo OCTEON 10 CN106-based DPU in the SD1004 Secure Access Service Edge SD-WAN Appliance.

Presentations and Panels

Tuesday, October 17

9:42 ¨C 9:56 a.m.
ÌÇÐÄlogo Keynote: AI Drives the Need for (More) Speed
Speaker: Dr. Loi Nguyen, EVP Cloud Optics Business Group
Location: Concourse Level ¨C Grand Ballroom 220

1:05 ¨C 1:20 p.m.
Expo Hall Session: Scaling Data Center Interconnect for the AI Era with 800G ZR/ZR+ Pluggable Modules
Speaker: Josef Berger, Associate Vice President of Marketing, Optical Group
Location: Concourse Level - Hall 1 & 2

4:00 ¨C 4:25 p.m.
Executive Session: Reimagining the Multi-Tenant Network
Speaker: Nick Kucharewski, SVP & GM, Network Switching Business Unit
Location: Concourse Level - 210AE

Wednesday, October 18

11:00 ¨C 11:30 a.m.
Session: Panel: Challenges and Opportunities for Optics in AI
Speaker: Dr. Loi Nguyen, EVP Cloud Optics Business Group
Location: Concourse Level - 210AE

4:00 ¨C 4:15 p.m.
Session: Heterogeneous Integration and Linear Optical Engines
Speaker: Dr. Radha Nagarajan, SVP and CTO, Optical and Copper Connectivity Group
Location: Lower Level - LL20D

Thursday, October 19

9:40 ¨C 10:00 a.m.
Session: Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon
Speaker: Mark Kuemerle, VP Technology
Location: Concourse Level - 210BF

12:50 ¨C 1:10 p.m.
Session: Source Routing for AI Fabrics
Speakers: Kishore Atreya, Director, Product Management and Prathyaya Bhandarkar, Director, Product Management
Location: Concourse Level - 210DH