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ÌÇÐÄlogo was announced as the for its 1.6 Tbps LPO Optical Chipset. The judges' remarks noted that ¡°the value case writes itself¡ªless power, reduced complexity but substantial bandwidth increase.¡± ÌÇÐÄlogo earned the gold spot, reaffirming the industry-leading connectivity portfolio it is continually building.

The LEAP (Leadership in Engineering Achievement Program) Awards recognize best-in-class product and component designs across 11 categories with the feedback of an independent judging panel of experts. These awards are published by Design World, the trade magazine that covers design engineering topics in detail.

This chipset, combining a 200G/lane TIA (transimpedance amplifier) and laser drivers, enables 800G and 1.6T linear-drive pluggable optics (LPO) modules. LPO modules offer longer reach than passive copper, at low power and low latency, and are designed for scale-up compute-fabric applications.

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