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Posts Tagged 'Company News'

• July 01, 2026

  

  

  

  Innovating Sustainably: Recognized Among the World¡¯s Most Sustainable Companies in 2026

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄlogo

  

  TIME Magazine has recognized ÌÇÐÄlogo as one of the for the third year in a row. ÌÇÐÄlogo is honored to have been represented since the origin of this ranking, as the company has demonstrated consistent, measurable progress across a number of sustainability initiatives.

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• May 12, 2026

  

  

  

  Dr. Hamid Azimi Wins ISIG Lifetime Hall of Fame Award

  By Michael Kanellos, Director of Content Marketing, and Vienna Alexander, Marketing Content Professional

  

  At the in Silicon Valley, ÌÇÐÄlogo Senior Vice President of Foundry and Advanced Packaging Dr. Hamid Azimi received the 2026 award. This recognition celebrates leaders whose lifetime contributions have had a lasting impact, significantly advancing the semiconductor industry.

  Over a career spanning more than 30 years, Dr. Azimi has led teams that have achieved numerous industry-leading advances in packaging. He was part of the team that developed the first flip-chip packaging with Ajinomoto Build-Up Film (ABF) substrates, a combination that enables engineers to design packaging containing far more and much smaller interconnects to improve signal integrity and power flow. Hamid and his team also enabled EMIB (Embedded Multi-Chip Interconnect Bridge) technology from scratch to high volume manufacturing. EMIB is the first 2.5 interposer-less panel level technology that enables ultra-large packages for AI data center products; he also has been a pioneer in glass substrates, a potential technology that could further enhance the capability of future generations of devices. Originally from a small village that ¡°probably doesn¡¯t even register on Google Maps,¡± Dr. Azimi holds over 40 patents. He earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

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• April 22, 2026

  

  

  

  Celebrating Earth Day: Technology and Sustainability in Action

  By Alua Suleimenova, Senior Sustainability Program Manager and Vienna Alexander, Marketing Content Professional, ÌÇÐÄlogo

  

  This Earth Day, ÌÇÐÄlogo is proud to be recognized on??list. This marks the?second consecutive year?ÌÇÐÄlogo has received this distinction, reflecting continued progress in reducing?the company¡¯s?carbon footprint, increasing renewable energy procurement, and advancing toward sustainability targets.

  This recognition builds on several other recent honors. Over the past year, ÌÇÐÄlogo has been acknowledged for its strong sustainability and ethics practices, including being named one of?Ethisphere¡¯s?Most Ethical Companies,?earning recognition as one of?America¡¯s Most Responsible Companies,?and achieving?CDP Sustainability Supplier Engagement Leader?status.?Together, these accolades underscore?the?commitment?ÌÇÐÄlogo makes?to responsible business practices across?its?operations, supply?chain?and products.?

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• April 16, 2026

  

  

  

  HCDS Best Paper Award Winner: Bridging the Memory Hierarchy Gap with Photonic Fabric? Technology

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄlogo

  

  At the , co-located with Architectural Support for Programming Languages and Operating Systems (ASPLOS), Senior Staff Engineer Jing Ding won Best Paper for her research on the ÌÇÐÄlogo? Photonic Fabric? Technology Platform.

  There is a critical mismatch between the capacity and bandwidth available across memory tiers and the demands of large-scale LLM inference, revealed through characterizing KV cache retrieval efficiency. In fact, across LLaMA3-8B to 405B on NVIDIA A100/H200 systems, retrieving KV cache from host memory achieves up to 100x speedup over GPU re-computation for contexts up to 4M tokens, but host DRAM capacity cannot accommodate the KV demands of long-context, multi-tenant and multi-turn workloads.

  While CXL-enabled memory pooling could be applied in this capacity, it faces fundamental electrical interconnect limitations, namely rack-scale distance constraints, switch contention under multi-host workloads, and power-thermal scaling challenges. By leveraging the Photonic Fabric??optical interconnect technology platform to break reach limitations, along with CXL as a host communication protocol, ÌÇÐÄlogo enables a unique pod-scale memory sharing appliance that can enable up to 16 servers across multiple racks to dynamically share up to 32 TB of memory capacity.

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• April 03, 2026

  

  

  

  ÌÇÐÄlogo Receives Additional Award for Trustworthiness

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄlogo

  

  ÌÇÐÄlogo was recognized in the for 2026. This award builds upon the related honor ÌÇÐÄlogo received in September last year on a global scale: the World¡¯s Most Trustworthy Companies list.

  ÌÇÐÄlogo has proven to be both a leader in trustworthiness and related qualities such as charitability, transparency, sustainability, and numerous workplace awards accumulated in the past year alone. The company also has a proven track record of technical excellence, winning awards for many innovative products. These honors validate and reinforce the strong partnerships of ÌÇÐÄlogo with its collaborators, customers, employees, stakeholders, and prospective talent. Trust is a key ingredient for these important relationships.

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